HI TEMP 300 - AMB - Resin - 3D Systems - Indicate Technologies

HI TEMP 300-AMB

$330.00
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Figure 4® HI TEMP 300-AMB is an ultra-high temperature plastic for use in applications requiring high heat resistance. With a heat deflection temperature of over 300 °C at both low and high stress (HDT at 0.455 and 1.82 MPa), this material is well suited for the testing of high-temperature components in applications including HVAC, consumer appliances, motor enclosures, stators, molds and the like. It does not require a secondary thermal post-cure.

Volume:
  • 1 kg
SKU: 420117-901

Explore reasons for using HI TEMP 300-AMB

Features

Applications

Properties

Compatibility

Features

- HDT over 300 °C at both low and high stress (HDT at 0.455 and 1.82 MPa)
- Rigid and translucent
- High tensile modulus for use in molds (4000 MPa)
- High Thermal-Resistance
- Translucent Amber Plastic for Flow Visualization (HDT >300 °C)
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Applications

- High-temperature components testing, and general use parts including: HVAC, consumer appliances, motor enclosures, stators, etc.
- Low-pressure molding/tooling: expanding foams, rubbers, etc.
- Overmolding
hi-temp-300-amb-3d-systems-indicate-technologies-845689

Properties

Key Mechanical Properties
- Elongation at break: 2.6%
- Tensile modulus: 4000 MPa
- Impact strength (notched Izod): 10 J/m
- Heat Deflection Temperature @ 0.455 and 1.82MPa: >300 °C


- Production-grade material
- High heat resistance for testing and use in high heat environments
- No secondary thermal post-cure required
- Excellent visualization for parts requiring evaluation of internal features and fluid flow performance
hi-temp-300-amb-3d-systems-indicate-technologies-845689

Compatibility

Printers
- Figure 4 Standalone
- Figure 4 Modular
- Figure 4 Production
hi-temp-300-amb-3d-systems-indicate-technologies-845689

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